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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10289001 B1

PDFFull Text
Date of Patent:
May. 14, 2019

Filed:

Mar. 27, 2017

Pattern forming method, etching method and method for producing capacitance-type input device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Hideaki Ito, Fujinomiya, JP;

Shinji Fujimoto, Fujinomiya, JP;

Yasumasa Kawabe, Fujinomiya, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/09 (2006.01); G03F 7/11 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); G03F 7/30 (2006.01); G03F 7/40 (2006.01); C08F 12/22 (2006.01); C08F 12/24 (2006.01); G03F 7/004 (2006.01); G03F 7/033 (2006.01); G03F 7/039 (2006.01); H03K 17/96 (2006.01); C08F 212/14 (2006.01); C08F 212/32 (2006.01); C08F 220/28 (2006.01);
U.S. Cl.
CPC ...
G03F 7/094 (2013.01); C08F 12/22 (2013.01); C08F 12/24 (2013.01); C08F 212/14 (2013.01); C08F 220/28 (2013.01); G03F 7/0045 (2013.01); G03F 7/033 (2013.01); G03F 7/039 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/11 (2013.01); G03F 7/161 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); G03F 7/30 (2013.01); G03F 7/40 (2013.01); H03K 17/962 (2013.01); C08F 2220/281 (2013.01); Y02P 20/582 (2015.11);
Abstract

A pattern forming method includes forming a photosensitive resin composition layer on at least one surface of a substrate using a photosensitive transfer material, exposing the photosensitive resin composition layer; and developing the exposed photosensitive resin composition layer, in which the photosensitive transfer material includes a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).

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