The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Nov. 23, 2011
Applicants:

Mengxin Zhao, Beijing, CN;

Xu Liu, Beijing, CN;

Peijun Ding, Beijing, CN;

Hougong Wang, Beijing, CN;

Wei Xia, Beijing, CN;

Lihui Wen, Beijing, CN;

Inventors:

Mengxin Zhao, Beijing, CN;

Xu Liu, Beijing, CN;

Peijun Ding, Beijing, CN;

Hougong Wang, Beijing, CN;

Wei Xia, Beijing, CN;

Lihui Wen, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 16/46 (2006.01); H01L 21/67 (2006.01); C23C 14/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/46 (2013.01); C23C 14/02 (2013.01); H01L 21/67103 (2013.01);
Abstract

The present invention provides a hot plate and substrate processing equipment using the same, wherein the hot plate comprises a central sub hot plate and at least one outer ring sub hot plate located around the central sub hot plate; thermal insulation parts are provided between the central sub hot plate and the outer ring sub hot plate and between two adjacent outer ring sub hot plates, so that the heat conduction between the adjacent sub hot plates can be effectively prevented or reduced by means of the thermal insulation parts. The hot plate and the substrate processing equipment using the same provided in the present invention can effectively compensate for the heat losses in the edge region of the substrate, so as to keep the heating rate the same in each region of the substrate.


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