The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Jun. 10, 2015
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Yong Sik Yoo, Uiwang-si, KR;
Jung Min Choi, Uiwang-si, KR;
Dong Hun Kang, Uiwang-si, KR;
Tae Wan Kim, Uiwang-si, KR;
Go Un Kim, Uiwang-si, KR;
Yong Kuk Kim, Uiwang-si, KR;
SAMSUNG SDI CO., LTD., Yongin-si, Gyeonggi-do, KR;
Abstract
The present invention relates to a CMP slurry composition, for an organic film, for polishing an organic film and an organic film polishing method using same, the CMP slurry composition comprising: a polar solvent and/or a non-polar solvent; metal oxide abrasives; an oxidant; and a heterocyclic compound, wherein the heterocyclic compound, as a heteroatom, comprises one or two of oxygen (O) atom, sulfur (S) atom and nitrogen (N) atom and has carbon content of 50-95 atom %.