The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Aug. 17, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Todd Sean Harple, Hillsboro, OR (US);
Francis Anthony Bitonti, East Moriches, NY (US);
Peter Emery Wildfeuer, New York City, NY (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 3/12 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); H05K 1/162 (2013.01); H05K 3/1275 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B41P 2217/50 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/0129 (2013.01);
Abstract
Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example 3D-printed structure includes a first conductive substrate, a second conductive substrate and a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction.