The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Oct. 25, 2016
Applicant:

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Terrance F. Little, Fullerton, CA (US);

Yuan Zhang, Rowland-Heights, CA (US);

An-Jen Yang, Irvine, CA (US);

Jie Zheng, Rowland-Heights, CA (US);

Yuan-Chieh Lin, Lake Forest, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/71 (2011.01); H01R 12/75 (2011.01); H01R 13/405 (2006.01); H01R 13/50 (2006.01); H01R 13/627 (2006.01); H01R 13/646 (2011.01); H01R 13/66 (2006.01); H01R 24/60 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 12/75 (2013.01); H01R 13/405 (2013.01); H01R 13/50 (2013.01); H01R 13/6275 (2013.01); H01R 13/646 (2013.01); H01R 13/665 (2013.01); H01R 24/60 (2013.01); H01R 2107/00 (2013.01); H01R 2201/06 (2013.01);
Abstract

An electrical cable connector assembly comprises a receptacle connector mated with a plug/cable connector. The receptacle connector mounted upon an external printed circuit board and includes an insulative housing forming a mating cavity, and a terminal module assembly received within the housing with contacting sections exposed in the mating cavity. The cable connector includes an internal printed circuit board with a contact module fixed at a front end region and a cable having a plurality of wires fixed at a rear end region in a multilevel manner. A die-casting cover encloses the internal printed circuit board with heat dissipation fin structure on an exterior surface.


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