The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Dec. 21, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

John Jianhong Zhu, San Diego, CA (US);

Jeffrey Junhao Xu, San Diego, CA (US);

Mustafa Badaroglu, Kessel-Lo, BE;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/10 (2006.01); H01L 27/118 (2006.01); H01L 21/8234 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 23/528 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11807 (2013.01); H01L 21/823475 (2013.01); H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 23/5386 (2013.01); H01L 27/0207 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11881 (2013.01);
Abstract

Standard cell circuits employing voltage rails electrically coupled to metal shunts for reducing or avoiding increases in voltage drop are disclosed. In one aspect, a standard cell circuit is provided that employs active devices that include corresponding gates disposed with a gate pitch. First and second voltage rails having a line width are disposed in a first metal layer. Employing the first and second voltage rails having substantially a same line width reduces the height of the standard cell circuit as compared to conventional standard cell circuits. Metal lines are disposed in a second metal layer with a metal pitch less than the gate pitch such that the number of metal lines exceeds the number of gates. Electrically coupling the first and second voltage rails to the metal shunts increases the conductive area of each voltage rail, which reduces a voltage drop across each voltage rail.


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