The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Jun. 19, 2017
Applicant:
Sumitomo Electric Device Innovations, Inc., Yokohama, Kanagawa, JP;
Inventor:
Keita Matsuda, Kanagawa, JP;
Assignee:
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13123 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/1401 (2013.01); H01L 2224/1405 (2013.01); H01L 2224/145 (2013.01); H01L 2224/1412 (2013.01); H01L 2224/14104 (2013.01);
Abstract
A semiconductor device of the ball grid array (BGA) type, the device having an electrode, and a process of forming the electrode are disclosed. The electrode includes an insulating film, a seed layer on the insulating film, a mound metal on the insulating film and an interconnection on the seed layer. The mound metal surrounds the seed layer without forming any gap therebetween. The interconnection, which is formed by electroless plating, is apart from the insulating film with the mound metal as an extension barrier for the plating.