The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Jul. 08, 2015
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Masahiro Sakashita, Hitachi, JP;

Naomi Watanabe, Hitachi, JP;

Masayuki Hanano, Hitachi, JP;

Kouji Mishima, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); C09G 1/02 (2006.01); H01L 23/532 (2006.01); B24B 37/04 (2012.01); B24B 37/00 (2012.01); H01L 21/768 (2006.01); C09K 13/06 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01); C09K 13/06 (2013.01); H01L 21/76865 (2013.01); H01L 21/31053 (2013.01); H01L 21/31058 (2013.01); H01L 21/7684 (2013.01); H01L 23/53238 (2013.01);
Abstract

An embodiment of the present invention relates to a CMP polishing liquid used for polishing a polishing target surface having at least a cobalt-containing portion and a metal-containing portion that contains a metal other than cobalt, wherein the CMP polishing liquid contains polishing particles, a metal corrosion inhibitor and water, and has a pH of 4.0 or less, and when the corrosion potential Eof cobalt and the corrosion potential Eof the metal are measured in the CMP polishing liquid, the absolute value of the corrosion potential difference E−Ebetween the corrosion potential Eand the corrosion potential Eis 0˜300 mV.


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