The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Dec. 23, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Anne M. Sepic, Phoenix, AZ (US);

Zhen Zhou, Tucson, AZ (US);

Evan M. Fledell, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); G01R 1/04 (2006.01); H01R 12/70 (2011.01); H01R 12/50 (2011.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1069 (2013.01); G01R 1/0466 (2013.01); H01R 12/7076 (2013.01); H01R 12/7082 (2013.01); H01R 23/6806 (2013.01); H05K 3/301 (2013.01); H05K 7/1023 (2013.01); H05K 7/1038 (2013.01); H05K 7/1061 (2013.01); H05K 1/181 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/2018 (2013.01);
Abstract

Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.


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