The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Jul. 19, 2017
Tdk Corporation, Tokyo, JP;
Kenichi Yoshida, Tokyo, JP;
Mitsuhiro Tomikawa, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
An electronic component embedded substrateincludes a substratehaving a wiring layerand an insulating layer; an electronic componentbuilt in the substrate, and having a pair of electrode layersA andB, and a dielectric layer; and a stress relieving layerprovided closer to the wiring layerthan the insulating layeris in the lamination direction, wherein at least part of an end portion of the electronic componenton the wiring layerside is in contact with the stress relieving layer, wherein at least part of an end portion of the electronic componenton the insulating layerside is in contact with the insulating layer, and wherein the Young's modulus of the stress relieving layeris lower than the Young's modulus of the electrode layerB.