The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Mar. 02, 2016
Applicant:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Inventors:

Fumimasa Horikiri, Hitachi, JP;

Kenji Shibata, Hitachi, JP;

Kazutoshi Watanabe, Hitachi, JP;

Masaki Noguchi, Tokyo, JP;

Kazufumi Suenaga, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/22 (2013.01); H01L 41/187 (2006.01); H01L 27/105 (2006.01); H01L 37/02 (2006.01); H01L 41/047 (2006.01); H01L 41/29 (2013.01); C23C 14/34 (2006.01); H01L 41/09 (2006.01); H01L 41/113 (2006.01); H01L 41/312 (2013.01); H01L 41/316 (2013.01); H01L 41/45 (2013.01);
U.S. Cl.
CPC ...
H01L 41/187 (2013.01); C23C 14/34 (2013.01); H01L 27/105 (2013.01); H01L 37/02 (2013.01); H01L 41/047 (2013.01); H01L 41/09 (2013.01); H01L 41/113 (2013.01); H01L 41/22 (2013.01); H01L 41/29 (2013.01); H01L 41/312 (2013.01); H01L 41/316 (2013.01); H01L 41/45 (2013.01);
Abstract

There is provided a ferroelectric thin-film laminated substrate, including a substrate, and further including a lower electrode layer, a ferroelectric thin-film layer, an upper electrode adhesive layer, and an upper electrode layer being sequentially stacked on the substrate, in which: the lower electrode layer is made of platinum or a platinum alloy; the ferroelectric thin-film layer is made of a sodium potassium niobate (typical chemical formula of (KNa)NbO, 0.4≤x≤0.7); the upper electrode layer is made of gold; the upper electrode adhesive layer is made of a metal that has less oxidizability than titanium and can make a solid solution alloy without generating an intermetallic compound with gold; and a part of the upper electrode adhesive layer and a part of the upper electrode layer are alloyed.


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