The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jun. 28, 2017
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Matteo Dainese, Villach, AT;

Fabio Brucchi, Villach, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 21/225 (2006.01); H01L 21/761 (2006.01); H01L 21/762 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7811 (2013.01); H01L 21/2255 (2013.01); H01L 21/2256 (2013.01); H01L 21/2257 (2013.01); H01L 21/761 (2013.01); H01L 21/76205 (2013.01); H01L 21/76224 (2013.01); H01L 21/76237 (2013.01); H01L 29/0619 (2013.01); H01L 29/0638 (2013.01); H01L 29/0661 (2013.01); H01L 29/0696 (2013.01); H01L 29/6634 (2013.01); H01L 29/7395 (2013.01); H01L 29/66333 (2013.01);
Abstract

A reverse-blocking IGBT (insulated gate bipolar transistor) includes a plurality of IGBT cells disposed in a device region of a semiconductor substrate, a reverse-blocking edge termination structure disposed in a periphery region of the semiconductor substrate which surrounds the device region, one or more trenches formed in the periphery region between the reverse-blocking edge termination structure and an edge face of the semiconductor substrate, a p-type dopant source at least partly filling the one or more trenches, and a continuous p-type doped region disposed in the periphery region and formed from p-type dopants out-diffused from the p-type dopant source. The continuous p-type doped region extends from a top surface of the semiconductor substrate to a bottom surface of the semiconductor substrate.


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