The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

May. 27, 2016
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Wei Cheng Wu, Zhubei, TW;

Chien-Hung Chang, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/11573 (2017.01); H01L 29/423 (2006.01); H01L 27/11568 (2017.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 27/11536 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11573 (2013.01); H01L 21/28273 (2013.01); H01L 21/28282 (2013.01); H01L 27/11536 (2013.01); H01L 27/11568 (2013.01); H01L 29/42328 (2013.01); H01L 29/42344 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/66545 (2013.01);
Abstract

The present disclosure relates to a method of forming an integrated circuit (IC). In some embodiments, a substrate is provided comprising a memory region and a logic region. A sacrificial logic gate electrode is formed within the logic region together with a control gate electrode or a select gate electrode within the memory region by patterning a control gate layer or a select gate layer. A first inter-layer dielectric layer is formed between the sacrificial logic gate electrode and the control gate electrode or the select gate electrode. A hard mask is formed over the first inter-layer dielectric layer to cover the memory region and to expose the sacrificial logic gate electrode within the logic region. The sacrificial logic gate electrode is replaced with a high-k gate dielectric layer and a metal layer to form a metal gate electrode within the logic region.


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