The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Jan. 27, 2016
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Tong-Yu Chen, Hsinchu, TW;
Chia-Fang Lin, Hsinchu, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 23/5222 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 23/485 (2013.01);
Abstract
An interconnect layout structure having air gaps includes a plurality of air gaps extended along a direction, and at least a first interconnect unit disposed in between the air gaps. The first interconnect unit includes a first conductive line, a first landing mark situated on the first conductive line and a first via structure situated on the first landing mark. The first via structure penetrates the first landing mark and is electrically connected to the first conductive line. And the first landing mark physically separates the air gaps arranged in a straight line.