The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Jul. 27, 2016
Applicant:
Namics Corporation, Niigata, JP;
Inventor:
Tomoyuki Takahashi, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C09D 5/24 (2006.01); C09J 9/02 (2006.01); C09J 161/06 (2006.01); H01L 23/00 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C09D 5/24 (2013.01); C09J 9/02 (2013.01); C09J 161/06 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/83851 (2013.01); H05K 1/095 (2013.01);
Abstract
An object of the present invention is to provide a resin composition suitable for copper pastes, which can be cured in an ambient atmosphere and has a viscosity within an appropriate range and a low specific resistance after curing. This resin composition includes (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid, (D) an amine, and (E) 4-aminosalicylic acid. Preferably, the (B) component is resol-type phenolic resin. More preferably, the (C) component is at least one selected from oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid, lauric acid, butyric acid, and propionic acid.