The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Dec. 01, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yu-Rung Hsu, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A method for forming a semiconductor device includes forming a fin over a substrate, forming an isolation region adjacent the fin, forming a dummy gate structure over the fin, recessing the fin adjacent the dummy gate structure to form a first recess using a first etching process, reshaping the first recess to form a reshaped first recess using a second etching process, wherein the second etching process etches upper portions of the fin adjacent the top of the recess more than the second etching process etches lower portions of the fin adjacent the bottom of the recess, and epitaxially growing a source/drain region in the reshaped first recess. Reshaping the first recess includes performing an oxide etch process, wherein the oxide etch process forms a porous material layer within the recess.