The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Sep. 13, 2017
Applicants:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

National Taiwan University, Taipei, TW;

Inventors:

Miin-Jang Chen, Taipei, TW;

Wei-Hao Lee, Taipei, TW;

Huan-yu Shih, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); C23C 16/455 (2006.01); C30B 29/40 (2006.01); C30B 25/02 (2006.01); C30B 25/18 (2006.01); H01L 21/02 (2006.01); H01L 29/778 (2006.01); H01L 29/205 (2006.01); C23C 16/44 (2006.01); H01L 29/20 (2006.01); C23C 16/30 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); C23C 16/303 (2013.01); C23C 16/4408 (2013.01); C23C 16/45536 (2013.01); C23C 16/45542 (2013.01); C30B 25/02 (2013.01); C30B 25/18 (2013.01); C30B 29/406 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02634 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/66795 (2013.01); H01L 29/7787 (2013.01); H01L 29/7851 (2013.01);
Abstract

In a method of manufacturing a high-electron mobility transistor (HEMT), a first Group III-V semiconductor layer is formed on a substrate. The first Group III-V semiconductor layer is patterned to form a fin and a recessed surface. A second Group III-V semiconductor layer is formed to cover a top surface and all side surfaces of the fin and the recessed surface. The second Group III-V semiconductor layer is formed by a plasma-enhanced atomic layer deposition, in which a plasma treatment is performed on every time an as-deposited mono-layer is formed.


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