The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Sep. 30, 2016
Applicant:
Synopsys, Inc., Mountain View, CA (US);
Inventor:
Colin Stewart Bill, Cupertino, CA (US);
Assignee:
Synopsys, Inc., Mountain View, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0292 (2013.01); H01L 21/78 (2013.01); H01L 22/34 (2013.01); H01L 27/0266 (2013.01); H01L 27/0296 (2013.01);
Abstract
A protection circuit for an integrated circuit product die or die-let (die-let) is responsive to whether the die-let has undergone a dicing operation or not. A test circuit on the die-let's semiconductor wafer can test and/or configure the die-let. After the dicing operation, the protection circuit generates a signal to isolate the cut input lines from the test circuit to prevent any interference with the normal operation of the integrated circuit product die-let.