The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Apr. 17, 2017
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventors:
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H04B 1/3827 (2015.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/66 (2013.01); H01L 25/50 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H04B 1/3827 (2013.01); H04B 1/40 (2013.01);
Abstract
A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.