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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10269746 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Oct. 05, 2015

Methods and apparatus for transmission lines in packages

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chin-Wei Kuo, Zhubei, TW;

Hsiao-Tsung Yen, Tainan, TW;

Min-Chie Jeng, Taipei, TW;

Yu-Ling Lin, Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Peter Dungba Vo

Assistant Examiner:

Kaying Kue

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/525 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 23/532 (2006.01); H01P 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/563 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/525 (2013.01); H01L 23/5225 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 23/5329 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53257 (2013.01); H01L 2223/6627 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01P 5/028 (2013.01); Y10T 29/49124 (2015.01);
Abstract

Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.

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