The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Dec. 10, 2015
Intel Corporation, Santa Clara, CA (US);
Gerrit John Vreman, Shingle Springs, CA (US);
Animesh Mishra, Pleasanton, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Flexible circuits mountable in a standoff region between a chip carrier, e.g., a ball grid array (BGA) component, and a printed circuit board (PCB) of a surface-mount package are described. In an example, a flexible circuit includes holes to receive pins, e.g., solder balls, of the BGA component, and one or more conductive leads electrically connected to respective solder balls within the holes. The conductive leads may interconnect several solder balls within the standoff region, and may be electrically accessible through a test pad located laterally outward from the standoff region. Electrical signals may be monitored or driven through the test pad, and thus, the flexible circuit may be used as a debug tool for detecting and or correcting a design fault of the surface-mount package.