The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Oct. 05, 2017
Applicants:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

National Taiwan University, Taipei, TW;

Inventors:

Shih-Yen Lin, Tainan, TW;

Kuan-Chao Chen, Tainan, TW;

Si-Chen Lee, Taipei, TW;

Samuel C. Pan, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01); H01L 29/15 (2006.01); H01L 21/336 (2006.01); H01L 29/861 (2006.01); H01L 21/02 (2006.01); B01J 27/045 (2006.01); H01L 29/778 (2006.01); C01G 39/06 (2006.01); H01L 29/267 (2006.01); H01L 29/417 (2006.01); H01L 29/10 (2006.01); H01L 21/3065 (2006.01); C01B 32/186 (2017.01);
U.S. Cl.
CPC ...
H01L 21/02568 (2013.01); B01J 27/045 (2013.01); C01G 39/06 (2013.01); H01L 21/0262 (2013.01); H01L 21/02205 (2013.01); H01L 21/02499 (2013.01); H01L 21/3065 (2013.01); H01L 29/1054 (2013.01); H01L 29/24 (2013.01); H01L 29/267 (2013.01); H01L 29/41766 (2013.01); H01L 29/66969 (2013.01); H01L 29/778 (2013.01); H01L 29/786 (2013.01); C01B 32/186 (2017.08);
Abstract

A method of fabricating a semiconductor device includes plasma etching a portion of a plurality of metal dichalcogenide films comprising a compound of a metal and a chalcogen disposed on a substrate by applying a plasma to the plurality of metal dichalcogenide films. After plasma etching, a chalcogen is applied to remaining portions of the plurality of metal dichalcogenide films to repair damage to the remaining portions of the plurality of metal dichalcogenide films from the plasma etching. The chalcogen is S, Se, or Te.


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