The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Aug. 21, 2015
Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Hidekazu Nakayama, Tokyo, JP;

Masami Matsui, Tokyo, JP;

Mikihiro Kashio, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C09J 183/06 (2006.01); C08K 3/00 (2018.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C08K 5/5435 (2006.01); C08K 5/544 (2006.01); C08K 9/06 (2006.01); C09K 3/10 (2006.01); C08L 83/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 33/56 (2010.01); C08G 77/04 (2006.01); C08G 77/24 (2006.01); C08G 77/388 (2006.01); C08G 77/392 (2006.01); C08K 5/3492 (2006.01); H01L 31/0216 (2014.01); C09J 183/04 (2006.01); C08L 83/06 (2006.01); C08G 77/16 (2006.01); C08G 77/18 (2006.01);
U.S. Cl.
CPC ...
C09J 183/06 (2013.01); C08G 77/04 (2013.01); C08G 77/24 (2013.01); C08G 77/388 (2013.01); C08G 77/392 (2013.01); C08K 3/00 (2013.01); C08K 3/36 (2013.01); C08K 5/34924 (2013.01); C08K 5/544 (2013.01); C08K 5/5435 (2013.01); C08K 9/06 (2013.01); C08L 83/04 (2013.01); C08L 83/06 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 183/04 (2013.01); C09K 3/10 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 31/0216 (2013.01); H01L 33/56 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention is a curable composition comprising a component (A), a component (B), a component (C), and a component (D), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:20,


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