The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Jan. 14, 2011
Applicants:

Shinichi Kurita, San Jose, CA (US);

Makoto Inagawa, Palo Alto, CA (US);

Takayuki Matsumoto, Cupertino, CA (US);

Inventors:

Shinichi Kurita, San Jose, CA (US);

Makoto Inagawa, Palo Alto, CA (US);

Takayuki Matsumoto, Cupertino, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B25J 19/00 (2006.01); B65G 49/06 (2006.01); C03B 35/20 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
B25J 19/0054 (2013.01); B65G 49/061 (2013.01); C03B 35/20 (2013.01); H01L 21/67109 (2013.01); H01L 21/67742 (2013.01); Y02P 40/57 (2015.11);
Abstract

Embodiments of the present invention provide a transfer robot having a cooling plate attached thereto for cooling a substrate during transfer between a processing chamber and a load lock chamber. In one embodiment, the cooling plate is a single, large area cooling plate attached to the transfer robot beneath the substrate being transferred. In another embodiment, the cooling plate is an array of substrates attached to the transfer robot beneath the substrate being transferred. The cooling plate may include a conduit path for circulating a cooling fluid throughout the cooling plate. The cooling plate may have an upper surface with a high emissivity coating applied thereto.


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