The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Dec. 15, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Yen-Chih Chen, Hsinchu, TW;
Yi-Chang Liu, Kaohsiung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A chemical mechanical polish (CMP) system is provided. The CMP system includes a platen rotatable about a rotation axis. The CMP system further includes a polishing pad positioned on the platen. The CMP system also includes a detecting module having a base portion and a number of pins positioned over the polishing pad. The pins are movable relative to the platen and have their bottom end in direct contact with the polishing pad to detect the planarity of the polishing pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile