The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

May. 12, 2017
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Joseph Gerard Schultz, Hoffman Estates, IL (US);

Yu-Ting Wu, Schaumburg, IL (US);

Shishir Ramasare Shukla, Chandler, AZ (US);

Enver Krvavac, Hoffman Estates, IL (US);

Hussain Hasanali Ladhani, Chandler, AZ (US);

Damon G. Holmes, Chandler, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H03F 3/19 (2006.01); H03F 3/24 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 23/49811 (2013.01); H01L 23/66 (2013.01); H01L 24/14 (2013.01); H03F 3/19 (2013.01); H03F 3/245 (2013.01); H01L 2223/6655 (2013.01); H03F 2200/451 (2013.01);
Abstract

A radio frequency (RF) chip capacitor circuit and structure are provided. The circuit and structure include a plurality of capacitors connected in series. Each capacitor of the plurality includes a first plate formed from a first metal layer and a second plate formed from a second metal layer. A first two adjacent capacitors of the plurality include first plates formed in a first contiguous portion of the first metal layer or second plates formed in a second contiguous portion of the second metal layer. Each capacitor of the plurality may include a dielectric layer disposed between the first plate and the second plate.


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