The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Aug. 15, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Young-Ju Kim, Hwaseong-si, KR;

Su-A Kim, Seongnam-si, KR;

Soo-Young Kim, Seoul, KR;

Min-Woo Won, Suwon-si, KR;

Bok-Yeon Won, Namyangju-si, KR;

Ji-Suk Kwon, Seoul, KR;

Young-Ho Kim, Hwaseong-si, KR;

Ji-Hak Yu, Yongin-si, KR;

Hyun-Chul Yoon, Yongin-si, KR;

Seok-Jae Lee, Yongin-si, KR;

Sang-Keun Han, Seongnam-si, KR;

Woong-Dai Kang, Seongnam-si, KR;

Hyuk-Joon Kwon, Yongin-si, KR;

Bum-Jae Lee, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); G11C 11/408 (2006.01); G11C 11/4091 (2006.01); G11C 11/4097 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/552 (2006.01); G11C 7/10 (2006.01); G11C 7/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5225 (2013.01); G11C 11/4087 (2013.01); G11C 11/4091 (2013.01); G11C 11/4097 (2013.01); H01L 23/50 (2013.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H01L 23/552 (2013.01); H01L 24/06 (2013.01); G11C 7/06 (2013.01); G11C 7/1057 (2013.01); H01L 24/20 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06159 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A memory device including a memory cell array region, includes, column selection signal lines formed in a first column conduction layer of the memory cell array region and extending in a column direction, global input-output data lines formed in a second column conduction layer of the memory cell array region different from the first column conduction layer and extending in the column direction and power lines formed in a shield conduction layer of the memory cell array region between the first column conduction layer and the second column conduction layer. The noises in the signal lines and the power lines may be reduced and performance of the memory device may be enhanced by forming the column selection signal lines and the global input-output data lines in different column conduction layers and forming the power lines in the shield conduction layer between the column conduction layers.


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