The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Apr. 20, 2017
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventor:

Kazuki Kajihara, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/4857 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/13 (2013.01); H01L 23/49833 (2013.01); H01L 24/48 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48091 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01);
Abstract

An interposer includes an insulating layer, conductor circuits formed in grooves formed on a first surface of the insulating layer respectively, and metal posts formed in openings extending from the grooves to a second surface of the insulating layer on the opposite side with respect to the first surface such that the metal posts are connected to the conductor circuits respectively. The insulating layer has an opening portion which accommodates an electronic component and is extending from the first surface to the second surface of the insulating layer, and each of the metal posts has an upper surface and a bottom surface on the opposite side of the upper surface such that the upper surface is connected to a respective one of the conductor circuits and that the bottom surface is exposed from the second surface of the insulating layer.


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