The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Oct. 05, 2016
Nexperia B.v., Nijmegen, NL;
Kan Wae Lam, Kwai Chung, HK;
Harrie Martinus Maria Horstink, Nijmegen, NL;
Sven Walczyk, Nijmegen, NL;
Chi Ho Leung, Kwun Tong, HK;
Thierry Jans, Nijmegen, NL;
Pompeo V. Umali, Kwai Chung, HK;
Shun Tik Yeung, Kwai Chung, HK;
Nexperia B.V., Nijmegen, NL;
Abstract
A semiconductor die has internal circuitry formed on two more internal layers, and die bonding pads arranged on a top surface of the die. The bonding pads are connected to the internal circuitry for providing input and output signals to the internal circuitry. One or more connecting lines electrically connect one or more pairs of the die bonding pads, thereby defining a bonding pad layout. The die bonding pads are arranged and connected with the connecting lines such that the bonding pad layout is reversible, which allows the die to be used in different package types (e.g., TSSOP or DFN) yet maintain a standardized pin arrangement without the necessity for long or crossed bond wires.