The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Nov. 28, 2016
Applicant:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Inventors:
Katsushi Yamashita, Tokyo, JP;
Yui Takahashi, Tokyo, JP;
Assignee:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08K 3/36 (2006.01); C08L 79/00 (2006.01); C08L 101/00 (2006.01); H01L 23/31 (2006.01); C08K 3/08 (2006.01); C08L 79/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08K 3/08 (2013.01); C08K 3/36 (2013.01); C08L 79/00 (2013.01); C08L 79/085 (2013.01); C08L 101/00 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); C08K 2003/0856 (2013.01); C08K 2003/0862 (2013.01); C08K 2003/0881 (2013.01); C08K 2201/005 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1067 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/186 (2013.01);
Abstract
Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, GaO, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.