The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Sep. 02, 2013
Applicant:

Semiconductor Technologies & Instruments Pte Ltd, Singapore, SG;

Inventors:

Jian Ping Jin, Singapore, SG;

Leng Kheam Lee, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); B25J 11/00 (2006.01); B25J 15/06 (2006.01); H01L 21/677 (2006.01); G01B 11/27 (2006.01); G01N 21/95 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); B25J 11/0095 (2013.01); B25J 15/0616 (2013.01); B25J 15/0658 (2013.01); B25J 15/0666 (2013.01); G01B 11/27 (2013.01); G01N 21/9501 (2013.01); H01L 21/67144 (2013.01); H01L 21/67706 (2013.01); H01L 21/6838 (2013.01); H01L 21/68757 (2013.01); G01N 2201/025 (2013.01); Y10T 29/49826 (2015.01);
Abstract

A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame.


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