The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Dec. 21, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shelby Ferguson, Lacey, WA (US);

Rashelle Yee, Puyallup, WA (US);

Russell S. Aoki, Tacoma, WA (US);

Michael Hui, Tacoma, WA (US);

Jonathon Robert Carstens, Lacey, WA (US);

Joseph J. Jasniewski, Olympia, WA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/00 (2006.01); G01K 1/00 (2006.01); G01K 7/16 (2006.01); H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/473 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
G01K 7/16 (2013.01); H01L 23/34 (2013.01); H01L 23/345 (2013.01); H01L 24/81 (2013.01); H01L 23/3128 (2013.01); H01L 23/473 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81139 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81234 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81908 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01);
Abstract

Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.


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