The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Oct. 20, 2017
Chunghwa Picture Tubes, Ltd., Taoyuan, TW;
Chunghwa Picture Tubes, LTD., Taoyuan, TW;
Abstract
The invention provides a forming method of a via hole, including: sequentially stacking a patterned first conductive layer, a first insulating layer, a patterned second conductive layer, and a second insulating layer on a substrate. The second conductive layer and the first conductive layer overlap in a normal direction of the substrate, such that the second insulating layer has a protrusion portion protruding away from the substrate. A photosensitive material layer covers the second insulating layer. The photosensitive material layer is exposed, wherein a depth of exposure is equal to a vertical distance from a top surface of the protrusion portion to a surface of the photosensitive material layer. The exposed photosensitive material layer is removed by development to form a first via hole exposing the second insulating layer. The exposed second insulating layer is etched to form a second via hole to expose the second conductive layer, and then the photosensitive material layer is removed. A manufacturing method of a pixel structure, using the forming method of the via hole, is also provided.