The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Jun. 19, 2017
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 25/065 (2006.01); H05K 3/34 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 7/02 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/83 (2013.01); H01L 25/105 (2013.01); H05K 1/111 (2013.01); H05K 1/182 (2013.01); H05K 1/183 (2013.01); H05K 3/3436 (2013.01); H05K 7/02 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19104 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10727 (2013.01); H05K 2203/1572 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01);
Abstract
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.