The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

May. 15, 2017
Applicant:

Win Semiconductors Corp., Tao Yuan, TW;

Inventors:

Jui-Chieh Chiu, Taoyuan, TW;

Chih-Wen Huang, Taoyuan, TW;

You-Cheng Lai, Taoyuan, TW;

Assignee:

WIN Semiconductors Corp., Tao Yuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H01L 28/10 (2013.01);
Abstract

A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate; a winding structure formed on a top side the semiconductor substrate, wherein the winding structure comprises one or more metal lines winding with respect to a center of the winding structure; and a backside metal formed under a backside of the semiconductor substrate; wherein a hollow slot is formed within the backside metal, and a projection of the winding structure is within the hollow slot.


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