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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10256139 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

Mar. 23, 2017

Chemoepitaxy etch trim using a self aligned hard mask for metal line to via

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Markus Brink, White Plains, NY (US);

Michael A. Guillorn, Yorktown Heights, NY (US);

Chung-Hsun Lin, White Plains, NY (US);

HsinYu Tsai, White Plains, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Tutunjian & Bitetto, P.C.

Erik Johnson

Primary Examiner:

Elias M Ullah

Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76807 (2013.01); G03F 7/0002 (2013.01); H01L 21/02118 (2013.01); H01L 21/31133 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 21/76816 (2013.01); H01L 21/76823 (2013.01); H01L 21/76838 (2013.01); H01L 21/76849 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 21/76897 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01);
Abstract

A method of forming metal lines that are aligned to underlying metal features that includes forming a neutral layer atop a hardmask layer that is overlying a dielectric layer. The neutral layer is composed of a neutral charged di-block polymer. Patterning the neutral layer, the hardmask layer and the dielectric layer to provide openings that are filled with a metal material to provide metal features. A self-assembled di-block copolymer material is deposited on a patterned surface of the neutral layer and the metal features. The self-assembled di-block copolymer material includes a first block composition with a first affinity for alignment to the metal features. The first block composition of the self-assembled di-block copolymer is converted to a metal that is self-aligned to the metal features.

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