The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Jul. 11, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yoon-Joo Eom, Hwaseong-si, KR;

Joon-Young Park, Seoul, KR;

Yongcheol Bae, Yongin-si, KR;

Won Young Lee, Seongnam-si, KR;

Seongjin Jang, Seongnam-si, KR;

Junghwan Choi, Hwaseong-si, KR;

Joosun Choi, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G11C 11/4096 (2006.01); G11C 11/4093 (2006.01); G11C 7/10 (2006.01);
U.S. Cl.
CPC ...
G11C 11/4096 (2013.01); G11C 7/1084 (2013.01); G11C 11/4093 (2013.01); G11C 2207/105 (2013.01);
Abstract

A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.


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