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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10254650 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

May. 31, 2017

Low temperature sc1 strippable oxysilane-containing coatings

Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Hong Min Huang, Shanghai, CN;

Chao Liu, San Jose, CA (US);

Helen Xiao Xu, Sunnyvale, CA (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:

Faegre Baker Daniels LLP

Primary Examiner:

Quoc Hoang

Int. Cl.
CPC ...
C09D 4/06 (2006.01); G03F 7/11 (2006.01); C09D 4/00 (2006.01); C09D 5/20 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); G03F 7/42 (2006.01); H01L 21/027 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); G03F 7/075 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C09D 4/00 (2013.01); C09D 4/06 (2013.01); C09D 5/20 (2013.01); G03F 7/0752 (2013.01); G03F 7/094 (2013.01); G03F 7/162 (2013.01); G03F 7/42 (2013.01); H01L 21/0274 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/31051 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01);
Abstract

A composition for forming a coating is provided including at least one oxysilane-containing polymer or oligomer having an oxysilane group and at least one other organic crosslinkable group; an endcapping agent; and a solvent. A coated substrate, wherein the substrate is a silicon wafer or coated silicon wafer, includes an organic planarization layer in contact with the substrate, a photoresist layer, and a middle layer positioned between the organic planarization layer and the photoresist layer. The middle layer is formed from a composition including at least one oxysilane-containing polymer or oligomer having an oxysilane group and at least one other organic crosslinkable group, an endcapping agent; and a solvent.

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