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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10253223 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

Mar. 31, 2017

Semiconductor device and method for manufacturing the same using an adhesive

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jung Hak Kim, Daejeon, KR;

Hee Jung Kim, Daejeon, KR;

Se Ra Kim, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Seung Hee Nam, Daejeon, KR;

Young Kook Kim, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Ismail A Muse

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); C09J 133/10 (2006.01); C09J 163/04 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); C08G 59/62 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 133/10 (2013.01); C08G 59/621 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); H01L 21/565 (2013.01); H01L 23/3157 (2013.01); H01L 25/065 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/181 (2013.01);
Abstract

The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.

Find Patent Forward Citations

Kim, Jung. (2019). Semiconductor device and method for manufacturing the same using an adhesive (U.S. Patent No. 10253223). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10253223

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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