The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Nov. 29, 2016
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Max Batres, Redwood City, CA (US);

Zhihong Yang, San Jose, CA (US);

Thomas Wunderer, Santa Cruz, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/78 (2006.01); H01L 29/20 (2006.01); H01L 29/32 (2006.01); H01L 33/02 (2010.01); H01L 33/32 (2010.01); H01S 5/183 (2006.01); H01S 5/323 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01); H01L 21/0201 (2013.01); H01L 21/0254 (2013.01); H01L 21/02389 (2013.01); H01L 21/02634 (2013.01); H01L 21/30625 (2013.01); H01L 21/7806 (2013.01); H01L 29/2003 (2013.01); H01L 29/32 (2013.01); H01L 33/0075 (2013.01); H01L 33/025 (2013.01); H01L 33/32 (2013.01); H01S 5/183 (2013.01); H01S 5/32308 (2013.01); H01S 2304/04 (2013.01);
Abstract

A method of thinning a bulk aluminum nitride substrate includes providing a bulk aluminum nitride (AlN) substrate with at least one epitaxially grown group-III-nitride layer on a first side of the substrate, applying a slurry having a high pH to a second side of the substrate opposite the first side, chemical mechanically polishing the second side of the substrate using the slurry to remove at least a portion of the substrate, resulting in a thinned layer with a thickness less than 50 microns, and bonding the epitaxial layer to a non-native substrate. A device has at least one active zone in a layer of epitaxial Group-III-nitride material, the epitaxial Group-III-nitride layer having a defect density of less than or equal to 10/cm.


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