The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Dec. 15, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Mark Robert Visokay, Dallas, TX (US);

Tae S. Kim, Dallas, TX (US);

Mahalingam Nandakumar, Richardson, TX (US);

Eric D. Rullan, Allen, TX (US);

Gregory B. Shinn, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 27/088 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 29/423 (2006.01); H01L 27/092 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 23/522 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 27/088 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/823475 (2013.01); H01L 21/823871 (2013.01); H01L 23/522 (2013.01); H01L 27/092 (2013.01); H01L 29/42364 (2013.01); H01L 29/66545 (2013.01); H01L 29/495 (2013.01); H01L 29/4916 (2013.01); H01L 29/4966 (2013.01);
Abstract

A method of limiting plasma charging damage on ICs. A die includes gate stacks on active areas defined by a field dielectric. A pre-metal dielectric (PMD) layer is over the gate electrode. A contact masking material pattern is defined on the PMD layer including first contact defining features for forming active contacts and second contact defining features for forming dummy contacts (DC's) including over active areas and gate electrodes. Contacts are etched through the PMD layer using the contact masking material pattern to form active contacts and DC's. A patterned metal 1 (M1) layer is formed including first M1 portions over the active contacts and dummy M1 portions over the DC's. Metallization processing follows including forming interconnects so that the active contacts are connected to MOS transistors on the IC, and the DC's are not electrically connected to the MOS transistors.


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