The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Oct. 17, 2016
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Hiroto Akaike, Naka, JP;
Kazuhiko Yamasaki, Naka, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 9/02 (2006.01); C09J 163/04 (2006.01); C09J 163/10 (2006.01); C09J 183/04 (2006.01); C09J 175/04 (2006.01); C09J 163/00 (2006.01); C08K 3/08 (2006.01); C08K 9/04 (2006.01); C08L 101/00 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C08K 3/08 (2013.01); C08K 9/04 (2013.01); C08L 101/00 (2013.01); C09J 9/02 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); C09J 163/10 (2013.01); C09J 175/04 (2013.01); C09J 183/04 (2013.01); H01L 21/52 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29411 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.