The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Dec. 22, 2015
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventors:
Kenichiroh Mukai, Englewood, CO (US);
Kwonil Kim, Englewood, CO (US);
Lee Gaherty, Englewood, CO (US);
Lutz Brandt, Berlin, DE;
Tafadzwa Magaya, Englewood, CO (US);
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/552 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); C23C 18/16 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01); C23C 18/36 (2006.01); C23C 18/40 (2006.01); C23C 18/42 (2006.01); C23C 18/50 (2006.01); C23C 18/54 (2006.01); H01L 21/48 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); C23C 18/1605 (2013.01); C23C 18/1641 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/1698 (2013.01); C23C 18/285 (2013.01); C23C 18/30 (2013.01); C23C 18/36 (2013.01); C23C 18/405 (2013.01); C23C 18/42 (2013.01); C23C 18/50 (2013.01); C23C 18/54 (2013.01); H01L 21/02211 (2013.01); H01L 21/02282 (2013.01); H01L 21/02301 (2013.01); H01L 21/4871 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 21/02076 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 25/50 (2013.01); H01L 2924/15311 (2013.01);
Abstract
The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.