The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Apr. 28, 2017
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Teruyuki Ishihara, Ogaki, JP;

Haiying Mei, Ogaki, JP;

Hiroyuki Ban, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/18 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/52 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/09 (2013.01); H05K 1/181 (2013.01); H05K 3/4007 (2013.01); H05K 3/4682 (2013.01); H01L 2224/0401 (2013.01); H05K 3/243 (2013.01); H05K 3/284 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10378 (2013.01);
Abstract

A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.


Find Patent Forward Citations

Loading…