The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Dec. 24, 2016
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Philip Measor, San Jose, CA (US);
Robert Danen, Pleasanton, CA (US);
Paul MacDonald, San Jose, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/306 (2006.01); G01R 31/28 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); G01R 31/2898 (2013.01); H01L 21/30608 (2013.01); H01L 21/30625 (2013.01); H01L 22/12 (2013.01); H01L 22/24 (2013.01); H01L 27/11582 (2013.01);
Abstract
Reverse decoration can be used to detect defects in a device. The wafer can include NAND stacks or other devices. The defect can be a channel bridge, a void, or other types of defects. Reverse decoration can preserve a defect and/or can improve defect detection. A portion of a layer may be removed from a device. A layer also may be added to the device, such as on the defect, and some of the layer may be removed.