The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Sep. 03, 2015
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventors:
Masayoshi Adachi, Yokkaichi, JP;
Jun Takayasu, Yokkaichi, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); B24B 49/00 (2012.01); B24B 21/00 (2006.01); B24B 49/12 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B24B 21/002 (2013.01); B24B 49/003 (2013.01); B24B 49/12 (2013.01); H01L 21/02035 (2013.01); H01L 21/02087 (2013.01); H01L 21/67219 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01);
Abstract
According to one embodiment, a polishing device includes a stage holding a wafer, a polishing part polishing a film formed on a circumferential edge portion of the wafer, a detector detecting a residual portion of the film on the circumferential edge portion, a first movable part moving the detector along a surface of the circumferential edge portion; and a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.