The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Jun. 28, 2016
Applicant:

Hermes-epitek Corp., Taipei, TW;

Inventor:

Chien-Yao Hung, Hsin-Chu, TW;

Assignee:

Hermes-Epitek Corp., Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 31/28 (2006.01); G01R 1/067 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); G01R 1/067 (2013.01); G01R 31/2834 (2013.01); G01R 31/2886 (2013.01); H05K 1/142 (2013.01); H05K 2203/049 (2013.01);
Abstract

The invention relates to a probe card structure, which comprises printed circuit board structure with a first through hole, a center stiffener with a second through hole, a first probe head module with a first through hole set and a plurality of first probe pins, and a second probe head module provided with a plurality of second probe pins. The first probe head module and the second probe head module are respectively arranged on a lower surface and an upper surface of the printed circuit board structure, wherein those first probe pins are set on a periphery of an opening of the first through hole set; and a portion of the second probe head module penetrating the first through hole, the second through hole, and the first through hole set. The first and second probe head module integrated together can be utilized for 3D IC testing.


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