The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2019

Filed:

Sep. 17, 2015
Applicant:

Asia Vital Components Co., Ltd., New Taipei, TW;

Inventors:

Sheng-Huang Lin, New Taipei, TW;

Yuan-Yi Lin, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28F 3/02 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
F28F 3/02 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); H01L 21/4882 (2013.01); H01L 23/427 (2013.01);
Abstract

A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.


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