The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Mar. 20, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Hironobu Miyamoto, Ibaraki, JP;

Yasuhiro Okamoto, Ibaraki, JP;

Hiroshi Kawaguchi, Ibaraki, JP;

Tatsuo Nakayama, Ibaraki, JP;

Assignee:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/20 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 21/306 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 21/0254 (2013.01); H01L 21/30612 (2013.01); H01L 29/1033 (2013.01); H01L 29/1037 (2013.01); H01L 29/2003 (2013.01); H01L 29/41775 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/0657 (2013.01); H01L 29/402 (2013.01); H01L 29/42356 (2013.01); H01L 29/42364 (2013.01);
Abstract

A property of a semiconductor device (high electron mobility transistor) is improved. A semiconductor device having a buffer layer, a channel layer, an electron supply layer, a mesa type cap layer, a source electrode, a drain electrode and a gate insulating film covering the cap layer, and a gate electrode formed on the gate insulating film, is configured as follows. The cap layer and the gate electrode are separated from each other by the gate insulating film, and side surfaces of the cap layer, the side surfaces being closer to the drain electrode and the source electrode, have tapered shapes. For example, a taper angle (θ1) of the side surface of the cap layer (mesa portion) is equal to or larger than 120 degrees. By this configuration, a TDDB life can be effectively improved, and variation in an ON-resistance can be effectively suppressed.


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