The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

May. 08, 2017
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Daniel Schloegl, Villach, AT;

Johannes Baumgartl, Riegersdorf, AT;

Matthias Kuenle, Villach, AT;

Erwin Lercher, Villach, AT;

Hans-Joachim Schulze, Taufkirchen, DE;

Christoph Weiss, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 31/111 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01); H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 21/283 (2006.01); H01L 21/265 (2006.01); H01L 29/36 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 29/861 (2006.01); H01L 29/868 (2006.01); H01L 21/266 (2006.01); H01L 29/16 (2006.01); H01L 29/167 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7395 (2013.01); H01L 21/0257 (2013.01); H01L 21/0262 (2013.01); H01L 21/265 (2013.01); H01L 21/283 (2013.01); H01L 29/0634 (2013.01); H01L 29/0688 (2013.01); H01L 29/0804 (2013.01); H01L 29/0834 (2013.01); H01L 29/1095 (2013.01); H01L 29/36 (2013.01); H01L 29/6606 (2013.01); H01L 29/6609 (2013.01); H01L 29/66204 (2013.01); H01L 29/66325 (2013.01); H01L 29/66333 (2013.01); H01L 29/66712 (2013.01); H01L 29/7802 (2013.01); H01L 29/861 (2013.01); H01L 29/868 (2013.01); H01L 21/266 (2013.01); H01L 29/167 (2013.01); H01L 29/1608 (2013.01); H01L 29/20 (2013.01); H01L 29/2003 (2013.01);
Abstract

A method of producing a semiconductor device is presented. The method comprises: providing a semiconductor substrate having a surface; epitaxially growing, along a vertical direction (Z) perpendicular to the surface, a back side emitter layer on top of the surface, wherein the back side emitter layer has dopants of a first conductivity type or dopants of a second conductivity type complementary to the first conductivity type; epitaxially growing, along the vertical direction (Z), a drift layer having dopants of the first conductivity type above the back side emitter layer, wherein a dopant concentration of the back side emitter layer is higher than a dopant concentration of the drift layer; and creating, either within or on top of the drift layer, a body region having dopants of the second conductivity type, a transition between the body region and the drift layer forming a pn-junction (Zpn). Epitaxially growing the drift layer includes creating, within the drift layer, a dopant concentration profile (P) of dopants of the first conductivity type along the vertical direction (Z), the dopant concentration profile (P) in the drift layer exhibiting a variation of a concentration of dopants of the first conductivity type along the vertical direction (Z).


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